Inductively Coupled Plasma Sources and Applications
نویسندگان
چکیده
منابع مشابه
Miniaturization of Inductively Coupled Plasma Sources
The scaling laws associated with the miniaturization of planar inductively coupled plasmas (ICPs) are investigated. The applications for miniature ICPs include microelectromechanical systems (MEMS) for chemical analysis. Langmuir probe and microwave interferometry measurements of three ICPs with coil diameters of 5, 10, and 15 mm show that electron density typically falls in the range of 10 10 ...
متن کاملModel for noncollisional heating in inductively coupled plasma processing sources
Low pressure ~,10 mTorr! inductively coupled plasma sources are being developed for etching and deposition of semiconductors and metals. In models for these devices, plasma dynamics are typically coupled to the electromagnetic fields through Ohm’s law, which implies that collisional heating is the dominant power transfer mechanism. In this article, we describe an algorithm to couple plasma dyna...
متن کاملInductively Coupled Plasma Sources at Low Driving Frequencies
Inductively Coupled Plasmas (ICPs) can be maintained over a wide range of driving frequencies, from 50 Hz to GHz. We have investigated the specifics of ICP operation at different frequencies which address: a) nonlinear plasma dynamics due to the disparity of time scales for ion transport and electron energy relaxation, b) the absence of time-varying magnetic field in plasma for certain ICP conf...
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متن کامل
Inductively Coupled Plasma Etching of Bulk Titanium for MEMS Applications
Titanium is a promising new material system for the bulk micromachining of microelectromechanical MEMS devices. Titaniumbased MEMS have the potential to be used for a number of applications, including those which require high fracture toughness or biocompatibility. The bulk titanium etch rate, TiO2 mask etch rate, and surface roughness in an inductively coupled plasma ICP as a function of vario...
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ژورنال
عنوان ژورنال: Physics Research International
سال: 2010
ISSN: 2090-2220,2090-2239
DOI: 10.1155/2010/164249